Interconnect substrate with circuits for field-programmability and testing of multichip modules and hybrid circuits
US5973340A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 17, 1997 |
| Grant date | Oct 26, 1999 |
| Priority date | — |
| Expiry date | Jul 17, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0286
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An interconnect structure is centered around a substrate having multiple component contacts for receiving electronic components. Multiple conductive traces are provided over the substrate or in multiple layers of the substrate. Each conductive trace is connected to one of the component contacts. A programmable IC having a group of separate conductive leads is connected to the substrate. Two or more of the conductive leads are connected to corresponding ones of the conductive traces. The IC has programmable elements, such as electrically programmable elements, for selectively connecting the conductive leads, thereby enabling selected conductive traces to be interconnected so as to achieve a desired electrical function from the electronic components connected to the substrate. A test chip, an interconnect structure that contains the test chip, and a related test method are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.