Heat frame for portable computer
US5973920A · kind A · utility
41Cited by
16References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 1996 |
| Grant date | Oct 26, 1999 |
| Priority date | — |
| Expiry date | May 31, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat frame (10) incorporates a mounting frame for mounting multiple circuit boards (38), a heat sink (24), a connector bracket (34), and hinge mounts (12) into one integral component. Heat removed by the heat sink (24) is transferred over the entire heat frame (10) with the aid of a heat pipe (44). Fins 17 dissipate heat through the housing of computer (50) under the display assembly (74). The integral nature of the heat frame (10) reduces assembly and testing costs, as well as providing superior heat transfer and EMI/RFI grounding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.