Chemical drying and cleaning system
US5974689A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 1998 |
| Grant date | Nov 2, 1999 |
| Priority date | — |
| Expiry date | Mar 3, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/26
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Method and apparatus for drying and/or cleaning a workpiece, such as an electronic part, semiconductor wafer, printed circuit board or the like. As the workpiece is withdrawn from a processing liquid, a selected drying liquid, such as hydrofluoroether (HFE) or an HFE azeotrope, that has a very small surface tension, is volatile, and has a density that is greater than the processing liquid density, is sprayed on, dribbled on or otherwise transferred to an exposed surface of the workpiece. The workpiece can be dried in 7-45 seconds, or less, in most situations and can be cleaned using the invention. Drying and/or cleaning can be performed in a single workpiece process, a single workpiece continuous process or a batch process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.