Diffusion bonding method and diffusion bonding apparatus
US5975405A · kind A · utility
17Cited by
3References
3Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 21, 1997 |
| Grant date | Nov 2, 1999 |
| Priority date | — |
| Expiry date | Apr 21, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A diffusion bonding method has a step of adjusting ends of material to be bonded before bonding the material after setting the materials in the diffusion bonding apparatus, whereas a diffusion bonding apparatus has a mechanism for finishing ends of materials to be bonded so that both ends face parallel to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.