Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same
US5976391A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 1998 |
| Grant date | Nov 2, 1999 |
| Priority date | — |
| Expiry date | Jan 13, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an improved multi-layer printed circuit assembly having at least two conductor patterns. The method includes providing a first layer having a first metal surface a second layer having a second metal surface. A thin flexible carrier is placed between the first and second layers. The first and second layers are attached to opposite surfaces of the carrier. The first and second metal surfaces are etched to form first and second conductor patterns. The conductor patterns form the electrical traces interconnecting components on an electronic circuit assembly. The first and second conductor patterns are electrically connected to form an electronic circuit assembly that includes electronic traces on both sides of the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.