Material and method for planarization of substrate
US5976703A · kind A · utility
9Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 1996 |
| Grant date | Nov 2, 1999 |
| Priority date | — |
| Expiry date | Jun 14, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A material and a method for planarizing an uneven surface of a substrate, such as those used for making wiring boards and electronic devices and having broad patterns on their surfaces, are provided. The material is a polysilphenylenesiloxane or a copolymer of polysilphenylenesiloxane with an organosiloxane, and is applied to an uneven surface of a substrate, and then heated to be reflowed to thereby be formed into a planarized film or layer. The material allows a substrate containing wiring having a width of up to several hundred micrometers to be planarized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.