Horizontal package having die supports leads formed along lead column
US5977619A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 13, 1998 |
| Grant date | Nov 2, 1999 |
| Priority date | — |
| Expiry date | Apr 13, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Supporting leads extend from one side portion of a package to another side portion thereof and are arranged on both sides of an island such that both ends of the island are supported. An electrode for a fixing potential of a semiconductor chip is connected to these supporting leads by a bonding wire. One end of these supporting lead is located outside a column of an outer lead portion as the same structure as the outer lead portion. Thus, while a structure for commonly using each of the supporting leads as a lead for a fixing potential is adopted, a thermal distribution of the semiconductor chip can be uniformed and no island is inclined at a resin seal time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.