Element interconnections for multiple aperture transducers
US5977691A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 10, 1998 |
| Grant date | Nov 2, 1999 |
| Priority date | — |
| Expiry date | Feb 10, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R17/08
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A multiple aperture ultrasonic transducer having a linear array of elements, each element having a plurality of segments forming apertures of the array, and a connection assembly for interconnecting the segments and connecting the segments to circuits. The connection assembly includes an electrode layer directly adjacent to the segments, at least one insulating layer, and at least one connector layer. The electrode layer has an electrode area for each segment and one of the insulating layers has a connection opening for each segment and connection areas for pairs of segments while the connection layer has segment to segment connectors and segment pad connectors. Each element may be divided into sub-elements with connection cross-overs offset by one sub-element along the array and alternately reversed while alternate middle segments connect to alternate sides. The connection assembly may include interlayer connector layer and may be constructed onto a carrier which may be removed before attachment to a backing body, or the connection assembly may be deposited onto the array before attachment to a backing body. The connection assembly may be fabricated as a single assembly with a mon…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.