Microstrip structure
US5977915A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 1998 |
| Grant date | Nov 2, 1999 |
| Priority date | — |
| Expiry date | Jun 25, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/0075
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An environmentally compatible microstrip structure for electromagnetic signals in the microwave frequency range and higher. The microstrip structure according to the invention comprises at least two dielectric bodies made of an inorganic non-metallic material. Conductors of the microstrip structure are disposed on a first dielectric body. The ground plane of the microstrip structure is disposed on a second dielectric body. The dielectric bodies are so oriented that the second dielectric is between the at least one conductor and the ground plane while the first dielectric body is not. At least one cavitity is formed in the second dielectric body around at least one of the conductors to thereby create a composite dielectric comprising gas/air/vacuum of the cavity and the second dielectric body. The composite dielectric giving the microstrip structure adequate performance with dielectrically poor but environmentally compatible dielectric materials forming the dielectric bodies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.