Patent · US Expired

Hydroforming die assembly for pinch-free tube forming

US5979201A · kind A · utility

12Cited by
6References
31Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 21, 1997
Grant dateNov 9, 1999
Priority date
Expiry dateAug 21, 2017

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB21D22/025
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A die assembly having die structures that are cooperable to define a die cavity into which a metallic tubular blank can be disposed. A first die structure is moveable to seal the die cavity, and after the die cavity is sealed, the first and second die structures are moveable to reduce the cross-sectional area of the die cavity and thereby deform the metallic tubular blank within the die cavity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.