Support frame and stencil having flexible end regions for attachment to the support frame
US5979312A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 26, 1997 |
| Grant date | Nov 9, 1999 |
| Priority date | — |
| Expiry date | Aug 26, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/1225
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A stencil of sheet metal for enabling solder paste to be applied to circuit boards includes a main body portion and opposite side regions which are apertured so as to be more flexible than the main body portion, and so as to enable these opposite side regions to be bent without kinking or other deformation during tensioning. The invention further includes an apparatus for enabling solder paste to be applied to a circuit board by a stenciling process, the apparatus including a stencil as described together with a support therefor, the stencil being attached to the support and being detachable therefrom. The side regions of the stencil are flexed for attachment to the support, so that the interconnection between the support and the stencil does not project beneath a lowermost planar surface of the stencil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.