Multi-layer, multi-grade multiple cutting surface PDC cutter
US5979578A · kind A · utility
140Cited by
25References
28Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 5, 1997 |
| Grant date | Nov 9, 1999 |
| Priority date | — |
| Expiry date | Jun 5, 2017 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B10/5673
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
An improved polycrystalline diamond composite ("PDC") cutter with secondary PDC cutting surfaces in addition to a primary PDC cutting surface is formed comprising of at least two wafers of cemented carbide bonded together. The secondary cutting surfaces are formed by compacting and sintering diamond in grooves formed at the surface of the wafers. Wafers of different grades of cemented carbide may be used. Moreover, different grades of diamond may be compacted and sintered in different grooves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.