Polycrystalline diamond cutter with enhanced durability
US5979579A · kind A · utility
48Cited by
62References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 11, 1997 |
| Grant date | Nov 9, 1999 |
| Priority date | — |
| Expiry date | Jul 11, 2017 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B10/5673
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A cutting element is provided for use with drill used in the drilling and boring through subterranean formations. This new cutter has improved wear characteristics while maximizing the manufacturability and cost effectiveness of the cutter. This invention accomplishes these objectives by incorporating a single chamfer of increased size. This chamfer is introduced on the periphery of the abrasive cutting face of the cutter. This chamfer has been found to reduce the tensile stress within the cutter, which tensile stress is primarily responsible for spalling and delamination of the abrasive layer of the cutter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.