Bonding machine
US5980663A · kind A · utility
31Cited by
2References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 27, 1998 |
| Grant date | Nov 9, 1999 |
| Priority date | — |
| Expiry date | Feb 27, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C66/961
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
This invention discloses a method of bonding a lower substrate with an upper substrate comprising applying an adhesive (56) on at least one of the lower (12) and the upper (14) substrates, and rotating the lower and the upper substrates thereby to create a centrifugal force which causes the adhesive to spread between the lower and the upper substrates with a substantially uniform thickness, while applying a pressure upon the upper substrate thereby to bond the lower and upper substrates. The invention also discloses an apparatus for bonding the lower substrate with the upper substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.