Production of a support element module for embedding into smart cards or other data carrier cards

US5980683A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Wolfgang Beck · Schwabsoien, DE
• Reinhold Braun · Leonberg, DE
• Roland Diemer · Aidlingen, DE
• Frank Druschke · Stuttgart, DE
• Gerhard Elsner · Kaarst, DE
• Harald Gruber · Herrenberg, DE
• Rainer Kratzert · Böblingen, DE
• Wolfgang Schmid · Regensburg, DE

Key dates

• Filing date: Jan 31, 1997
• Grant date: Nov 9, 1999
• Expiry date: Jan 31, 2017

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Described is a method for manufacturing of carrier element modules of a thin carrier element (4) and a thereon mounted semiconductor chip (2). This method renders possible the application of chips (2) with great dimensions (macro-chips) and a wide variety of different types. A chip transfer moulding process is designed so that a minimised height--without the need for reworking--is achievable, and therefore a less costly surface mounting of the chips can be applied. The manufactured module according to the invention can be used as well as in flexible circuit boards (e.g. for cameras) or in chipcards. The method according to the present invention has a first step of putting the at least one IC (2) onto the carrier element (4), a second step of contacting the at least one IC (2) with the carrier element (4) and a third step of transfer moulding a transfer moulding compound (18) to encapsulate the IC (2).