Methods of treating crystal-grown wafers for surface defect analysis
US5980720A · kind A · utility
19Cited by
1References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 24, 1997 |
| Grant date | Nov 9, 1999 |
| Priority date | — |
| Expiry date | Nov 24, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/928
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods of treating wafers for analyzing defects present therein comprise providing wafers having front side surfaces comprising defective portions and a back side surfaces opposite thereto; and decorating the defective portion of the front side of the wafer with copper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.