Process for heat-treating substrate having film-forming composition thereon
US5980991A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Oct 23, 1996 |
| Grant date | Nov 9, 1999 |
| Priority date | — |
| Expiry date | Oct 23, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/022
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Firing process and apparatus for uniformly heat-treating a substrate having a film-forming composition thereon, wherein the substrate is subjected to a first soaking step in which the substrate is held for a predetermined time in a first heating chamber whose temperature is maintained at a first value, so that the temperature within the substrate is held at the first value evenly throughout an entire mass of the substrate, and after feeding of the substrate into a second heating chamber whose temperature is maintained at a predetermined second value which is different from the first value by a predetermined difference, the substrate is subjected to a second soaking step in which the substrate is held for a second predetermined time in the second heating chamber, so that the temperature within the substrate is held at the second value evenly throughout the entire mass of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.