Pins for electronic assemblies
US5981090A · kind A · utility
3Cited by
2References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 12, 1998 |
| Grant date | Nov 9, 1999 |
| Priority date | — |
| Expiry date | Aug 12, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12861
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The pin for electronic assemblies according to the present invention consists of a core alloy with 0.2 to 1.5 wt. % Ag, the remainder copper, whereby at least the contact surface of the pin is provided with one or several highly conductive and/or easily solderable coatings. With this not only a higher electric conductivity of the contact is obtained but also a comparatively high strength with simple production and good workability, which makes it possible to miniaturize the pins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.