Patent · US Expired

Low-shrinkage polyethylene moulding compounds

US5981664A · kind A · utility

20Cited by
4References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 11, 1997
Grant dateNov 9, 1999
Priority date
Expiry dateDec 11, 2017

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L23/0815
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Molding compositions are based on polymers of ethylene made from PA1 (A) from 40 to 65% by weight of an ethylene polymer having a density in the range from 0.948 to 0.964 g/cm.sup.3, a melt flow index (MFI) of from 6 to 20 g/10 min and a mean molar mass distribution M.sub.w /M.sub.n in the range from 2 to 5, PA1 (B) from 35 to 60% by weight of an ethylene polymer having a density in the range from 0.935 to 0.953 g/cm.sup.3, a melt flow index (MFI) of from 0.1 to 0.35 g/10 min and a mean molar mass distribution M.sub.w /M.sub.n in the range from 6 to 20, and PA1 (C) from 0 to 6% by weight of the usual additives for thermoplastics, where the density of the molding compositions is in the range from 0.948 to 0.957 g/cm.sup.3, the melt flow index is in the range from 1.0 to 2.0 g/10 min, the mean molar mass distribution M.sub.w /M.sub.n is in the range from 3 to 10 and the difference of the densities of components A and B (.DELTA.D=D.sub.(A) -D.sub.(B)) is in the range from 0 to 0.029 g/cm.sup.3.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.