Semiconductor device with good thermal behavior

US5982028A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Heinz Pape · Aschheim, DE
• Frank Hubrich · Dresden, DE

Key dates

• Filing date: Feb 28, 1996
• Grant date: Nov 9, 1999
• Expiry date: Feb 28, 2016

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

One embodiment of a semiconductor device includes a semiconductor chip having long sides. A system carrier is connected to the semiconductor chip and has an island. The island has an opening formed centrally therein over a large area. The opening is wider than the semiconductor chip on two of the long sides of the semiconductor chip. Another embodiment of a semiconductor device includes a semiconductor chip having corner regions. A system carrier is connected to the semiconductor chip and has an island with an opening formed therein. The semiconductor chip is joined to the island only in the corner regions.