Silicone die attach adhesive, method for the fabrication of semiconductor devices, and semiconductor devices
US5982041A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 1997 |
| Grant date | Nov 9, 1999 |
| Priority date | — |
| Expiry date | Apr 9, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A silicone die attach adhesive comprising a silicone composition that cures both through the free radical reaction of acrylic-functional organopolysiloxane as induced by exposure to high-energy radiation and through the hydrosilylation reaction between alkenyl-functional organopolysiloxane and silicon-bonded hydrogen-functional organopolysiloxane. Also, a fabrication method characterized by PA0 mounting a semiconductor chip on a substrate or in a package with the aforesaid silicone die attach adhesive sandwiched between the semiconductor chip and substrate or package, PA0 then inducing the free radical reaction of the acrylic functional groups by exposing the die attach adhesive to high-energy radiation, and thereafter PA0 curing the die attach adhesive by the hydrosilylation reaction. A semiconductor device characterized in that it has been fabricated by the above-described method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.