Printed circuit board that provides improved thermal dissipation
US5982630A · kind A · utility
30Cited by
2References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 6, 1997 |
| Grant date | Nov 9, 1999 |
| Priority date | — |
| Expiry date | Nov 6, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board to support an integrated circuit and provide thermal dissipation. A layer of thermally conductive material is disposed between lower and upper dielectric layers. Above this structure is disposed another layer of thermally conductive material to be thermally coupled to an integrated circuit. A thermal via couples the two layers of thermally conductive material to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.