Opposed ball grid array mounting
US5982633A · kind A · utility
66Cited by
12References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 20, 1997 |
| Grant date | Nov 9, 1999 |
| Priority date | — |
| Expiry date | Aug 20, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board or card includes a pair of ball grid array packages connected one over the other on opposite sides of the board or card. The packages may connect through feed-through vias so that board space on the underside of the board, populated by feed-through vias, can be utilized to provide additional functionality. In one implementation, GTL resistive terminations and decoupling capacitors may be included in the ball grid array package on the underside of the board or card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.