Flux-encased resilient solder preforms and process for the preparation thereof

US5984161A · kind A · utility

Assignee

• Degussa-Huels AG · DE

Inventors

• Jurgen Koch · Refrath, DE
• Leander Staab · Mömbris, DE

Key dates

• Filing date: Dec 8, 1997
• Grant date: Nov 16, 1999
• Expiry date: Dec 8, 2017

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K35/0222
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Relatively resilient flux encasings for solder preforms are obtained when a mixture of 5 to 30 wt. % potassium silicate having a molar ratio of K.sub.2 O:SiO.sub.2 ranging from 1:2.5 to 1:4.5, 0.5 to 10 wt. % concentrated phosphoric acid, 0.1 to 5 wt. % boric acid and 0 to 10 wt. % finely divided silicon dioxide, with the remainder water, is used as the binder.