Method for recording the heat generated in a hole wall of a substrate during a drilling operation
US5984523A · kind A · utility
6Cited by
17References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 1998 |
| Grant date | Nov 16, 1999 |
| Priority date | — |
| Expiry date | Feb 3, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a system for recording a heat exchange event within a drilled hole wall of a substrate during a drilling process. In particular, the invention includes a thermal sensitive film placed in contact with a substrate which is to be drilled, which is capable of recording a thermal signature of the heat transferred during the drilling process. The result is a ring shaped signature whose thickness provides a direct correlation to drilling temperature. With these results, the integrity of the substrate surrounding the drilled hole can be inspected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.