Ground clip apparatus for circuit boards
US5984697A · kind A · utility
29Cited by
7References
16Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 3, 1997 |
| Grant date | Nov 16, 1999 |
| Priority date | — |
| Expiry date | Dec 3, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A ground clip apparatus is designed to make ground contact between two circuit boards as they are mated together. A standoff member is mounted on one of the boards and a spring clip member is mounted on the other board facing the standoff member. The spring clip member has spring arms which are biased against the standoff member when the boards are mated together to make a reliable ground contact. At the same time, the standoff member resists deflection of either board towards the other board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.