Method of fabricating a semiconductor device
US5984699A · kind A · utility
7Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 1997 |
| Grant date | Nov 16, 1999 |
| Priority date | — |
| Expiry date | Jan 29, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame is formed by subjecting a frame base to a forming process, a semiconductor chip is fixed on leads formed in the lead frame and wires are provided in the semiconductor chip, and then a package which accommodates the semiconductor chip is formed; a non-conductive adhesive being provided, before the forming process, on a position on the frame base in which the leads are formed, and unnecessary portions of the frame base and the non-conductive adhesive being removed in the forming process so that the leads having a predetermined configuration and provided with the non-conductive adhesive are formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.