Patent · US Expired

Methods and apparatus for increasing wire diameter to improve connectability

US5984711A · kind A · utility

11Cited by
5References
32Claims
0Family size

Assignee

Inventor

Key dates

Filing dateSep 10, 1998
Grant dateNov 16, 1999
Priority date
Expiry dateSep 10, 2018

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/53852
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

Methods and apparatus for connecting relatively small wires to standard size electrical connectors. An enlarged conductive region is formed on an end of the wire, the conductive region having an outer dimension adapted to be securely received in the connector, and the enlarged conductive region is covered with a nonconductive sleeve to electrically isolate the conductive region, the conductive region and nonconductive sleeve together defining an enlarged connector lead. The enlarged conductive region may be a conductive tube through which the wire is inserted and then spot welded, folded and/or crimped, or a multiple folded segment of the wire end, covered by a nonconductive shrink tube. The resulting enlarged connector lead may be received in a standard insulation displacement connector as part of a system for coupling the wire to electrical circuitry, the connector including a blade for piercing the nonconductive sleeve to electrically couple the wire to a terminal on the connector.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.