Method for making cleaved facets for lasers fabricated with gallium nitride and other noncubic materials
US5985687A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 1996 |
| Grant date | Nov 16, 1999 |
| Priority date | — |
| Expiry date | Apr 12, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/977
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Optically flat cleaved facet mirrors are fabricated in GaN epitaxial films grown on sapphire by wafer fusing a GaN film with a sapphire substrate to a cubic substrate such as an InP or GaAs substrate. The sapphire substrate may then partially or entirely removed by lapping, dry etching, or wet etching away a sacrificial layer disposed in the interface between the sapphire substrate and the GaN layer. Thereafter, the cubic InP or GaN substrate is cleaved to produce the cubic crystal facet parallel to the GaN layer in which active devices are fabricated for use in lasers, photodetectors, light emitting diodes and other optoelectronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.