Patent · US Expired

Tapered structure suitable for microthermocouples microelectrodes, field emission tips and micromagnetic sensors with force sensing capabilities

US5986261A · kind A · utility

15Cited by
3References
30Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 29, 1997
Grant dateNov 16, 1999
Priority date
Expiry dateOct 29, 2017

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S977/879
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A tapered, nonconductive structure (10) having a hollow core (18) and a conical tip (14) includes a metal wire (16) within the core (18). The wire (16) is sealed within, and is exposed at the end (22) of, the tip (14). An electrically conductive or semiconductive layer (24) on the exterior of the tip (14) form a point thermocouple contact with the wire. The tip (14) may be fabricated, for example, by placing a metal wire (16) within a tube (12), and heating and pulling the tube (12) to produce two tapered micropipettes. Thereafter, a thin metal or semiconductor film (24) is evaporated onto the outer surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.