Laminated multilayer substrates
US5986339A · kind A · utility
25Cited by
26References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 1998 |
| Grant date | Nov 16, 1999 |
| Priority date | — |
| Expiry date | Jul 14, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer package includes a plurality of interconnected large-layer-count (LLC) substrates. The LLC substrates each include conductive pads on the top and bottom surfaces of the substrate, a via in the substrate including conductive material to contact the pads on the top and bottom surfaces, and a post on a pad over the via. The posts of the substrates confront and abut each other, and are electrically bonded together. A non-flowable adhesive film mechanically bonds the LLC substrates, and has an aperture receiving the posts of the substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.