Semiconductor device
US5986341A · kind A · utility
18Cited by
3References
55Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 1998 |
| Grant date | Nov 16, 1999 |
| Priority date | — |
| Expiry date | Feb 9, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A condenser, a coil and a thin-thickness integrated circuit are placed between an upper cover sheet and a lower cover sheet, and adhesive is filled into the space between them, whereby a card is fabricated. Because the condenser, the coil and the thin-thickness integrated circuit are extremely thin, the resulting semiconductor device is highly resistant to bending and highly reliable at a low cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.