Semiconductor package with internal heatsink and assembly method
US5986885A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 8, 1997 |
| Grant date | Nov 16, 1999 |
| Priority date | — |
| Expiry date | Apr 8, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a semiconductor die, a lead frame and die attach paddle, and a thermally conductive metal foam porous sponge attached to the die attach paddle to conduct heat generated by operation of the die to the outside of the semiconductor package. In another embodiment the chip is mounted directly on the sponge. A flip-chip interconnection is also disclosed. In the method, a die and lead frame assembly is placed on a sponge in the cavity of a package two-part mold, the mold is closed and filled with encapsulant. A ball grid array semiconductor package with an internal sponge heatsink mounted directly on or in a substrate such as a printed circuit board with circuitry metallization, and a semiconductor die, wire-bonded or soldered to the metallization and adhered to the sponge heatsink, is also included.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.