Laser machining of molded assemblies
US5987740A · kind A · utility
5Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 22, 1996 |
| Grant date | Nov 23, 1999 |
| Priority date | — |
| Expiry date | Oct 22, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat generating component is encapsulated within an encapsulant. A window is made in the encapsulant to expose a heat dissipating surface of the component and a heat sinking device is attached to the heat dissipating surface of the heat generating component. The window is formed using a laser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.