Electronic component cooling using a heat transfer buffering capability
US5987890A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 1998 |
| Grant date | Nov 23, 1999 |
| Priority date | — |
| Expiry date | Jun 19, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Heat transfer out of a housing for a locallized source of heat such as that produced by a semiconductor chip of electronic apparatus is provided by a low thermal impedance heat transfer member such as a heat pipe, a thermal reservoir or heat transfer buffering member and a Peltier effect device interfaced with the thermal reservoir and the ambient surrounding the housing so as to provide a refrigeration function for the thermal reservoir. A high heat capacity or high latent heat of phase transition material can be used for the thermal reservoir. In a portable computer with a battery power supply, the thermal reservoir can be independent or the battery can be employed in the thermal reservoir functions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.