Bonded cast, pin-finned heat sink and method of manufacture
US5988266A · kind A · utility
29Cited by
12References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 1998 |
| Grant date | Nov 23, 1999 |
| Priority date | — |
| Expiry date | Aug 5, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high performance, high pin fin density heat sink (10) has mating first and second opposing base members (22, 24) having first and second pin fins (18, 20) extending generally perpendicularly therefrom. The pin fins (18, 20) are generally cylindrical and each bonded into recesses (30,32) formed on the opposing base member (22, 24). The spaces between nearest adjacent first and second pin fins (18, 20) form narrow fluid passageways (12) having a gas inlet in (14) for communicating with a heat generating body and gas out let end (16).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.