Synthetic resin granulating die
US5989009A · kind A · utility
11Cited by
9References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 11, 1998 |
| Grant date | Nov 23, 1999 |
| Priority date | — |
| Expiry date | Feb 11, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C48/865
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Retaining boards 14 and 18 having vacuum heat-insulating layers 17 and 21 are provided on the surface of a granulating die except a hardening layer 13 having a number of nozzle holes 2, namely, the surfaces of the granulating die 1 which are outside and inside of the hardening layer 13.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.