Polyamide adhesives having improved bookbinding characteristics
US5989385A · kind A · utility
5Cited by
13References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 1997 |
| Grant date | Nov 23, 1999 |
| Priority date | — |
| Expiry date | Mar 14, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J177/12
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method of bookbinding comprising the steps of a) applying a film comprising at least one hot melt polyamide at an application temperature of between about 175.degree. C. and about 190.degree. C. to the backbone of a book block said film having a tensile strength greater than about 400 psi and a Young's modulus of less than about 12,000 psi and b) covering said book block having said film of polyamide with a book cover having a portion thereof in substantially parallel relation to said film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.