Compliant and crosslinkable thermal interface materials
US5989459A · kind A · utility
33Cited by
2References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 1999 |
| Grant date | Nov 23, 1999 |
| Priority date | — |
| Expiry date | Mar 9, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S524/91
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Described is a compliant and crosslinkable thermal interface material of at least one malenized rubber with maleic anhydride adducted to the molecule and at least one hydroxyl terminated olefin rubbers, and a method of making and using same; as well as a method of improving thermal conductivity of polymer systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.