Heat mode recording element based on a thin metallic recording layer
US5989777A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 1998 |
| Grant date | Nov 23, 1999 |
| Priority date | — |
| Expiry date | May 19, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat mode element with improved mechanical properties is disclosed comprising a transparent support, a thin metallic recording layer, an adhesive layer, a polymeric resin layer and a top layer comprising a roughening agent in such an amount that the R.sub.a value of said top layer is at least 0.08 .mu.m and the R.sub.z value is at least 0.6 .mu.m. In a preferred embodiment the metallic recording layer is a bismuth layer, and the support has on the other side a backing layer with a low R.sub.a and R.sub.z value. In an alternative embodiment the top layer is absent and the roughening agent is incorporated in the polymeric resin layer itself. Also disclosed is a method for obtaining a heat mode image by the information-wise laser exposure of the disclosed element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.