Cavity uniformity having patterned spaces of aluminum oxide or silicon dioxide
US5991000A · kind A · utility
14Cited by
20References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 1996 |
| Grant date | Nov 23, 1999 |
| Priority date | — |
| Expiry date | Jun 13, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/13394
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for forming a uniform cavity between electrode substrates of a dlay comprises the steps of patterning a border to define a display area between the electrode substrates, patterning electrode spacers between the electrode substrates, and wafer bonding the electrode substrates to the border and to the electrode spacers to form a uniform cavity within the display area. A cavity comprises a pair of substrates enclosing the cavity and patterned spacers wafer bonded to the substrates to form and maintain a uniform thickness of the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.