Packaging of reactive hot-melt adhesives
US5992130A · kind A · utility
0Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 1997 |
| Grant date | Nov 30, 1999 |
| Priority date | — |
| Expiry date | Nov 21, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D3/22
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
The invention relates to a process for packaging reactive hot-melt adhesive, which consists of pouring the adhesive composition in the molten state directly into a container (1) coated with a material (2) which is abherent on its inner face and with a material (3) which is moistureproof on its outer face, the container being provided with at least one easy-opening start device; and in securing a moisture-proof lid (4) to the free face of the container. It also relates to the packaged adhesives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.