Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys
US5993574A · kind A · utility
3Cited by
14References
18Claims
0Family size
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Key dates
| Filing date | Nov 7, 1997 |
| Grant date | Nov 30, 1999 |
| Priority date | — |
| Expiry date | Nov 7, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A higher order beryllium-nickel-copper alloy a process for making the same, and an article of manufacture comprising the alloy, the alloy being represented by the formula (0.15-0.5% Be)+(0.40-1.25% Ni)+(0-0.25% Sn)+[(0.06-1% Zr) and/or (0.06-1% Ti)], the balance copper, where the sum of % Zr and % Ti is generally within a range of 0.06% and 1%, the alloy being characterized by improved electrical conductivity, bend formability and stress relaxation resistance without sacrificing strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.