Method and apparatus for aiming a spray etcher nozzle
US5993681A · kind A · utility
2Cited by
8References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 8, 1998 |
| Grant date | Nov 30, 1999 |
| Priority date | — |
| Expiry date | May 8, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/681
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for achieving alignment between a spray etcher nozzle and a semiconductor (either microelectronic or optoelectronic, for example) wafer surface. A spray nozzle tip is temporarily removed from the spray nozzle and an illumination source, such as a low power laser, is activated and inserted in its place. The laser emission illuminates the wafer surface and, by adjusting the position of the nozzle, alignment between the nozzle and wafer can be achieved. Once aligned, the nozzle is locked in place and the laser is replaced with the conventional spray nozzle tip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.