Patent · US Expired

Method of producing an aluminum film

US5993908A · kind A · utility

2Cited by

6References

12Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Manfred Schneegans · Vaterstetten, DE
Stefan Dietrich · Potsdam, DE
Alexander Hirsch · Munich, DE

Key dates

Filing date	May 28, 1997
Grant date	Nov 30, 1999
Priority date	—
Expiry date	May 28, 2017

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S438/927
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method of producing an aluminum film on a substrate, from which very narrow aluminum conductor tracks can be created that are highly resistant to electromigration and/or stress migration. The substrate with the polycrystalline aluminum film is cooled in an oven in a controlled fashion from a target temperature to a final temperature such that energetically stable Al.sub.2 Cu-.theta.-phases are formed directly among the individual aluminum grains in the aluminum film. The cooling is controlled such that the instantaneous temperature passes through a predetermined temperature profile. Within the range of 320.degree. C. to 200.degree. C., the cooling gradient is less than 6.degree. C. per hour.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.