Temperature coefficient of offset adjusted semiconductor device and method thereof
US5994161A · kind A · utility
39Cited by
12References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 1997 |
| Grant date | Nov 30, 1999 |
| Priority date | — |
| Expiry date | Sep 3, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A non-zero temperature coefficient of offset (Tco) in a semiconductor device (5) is adjusted by reducing the amount of adhesive material used to secure a first structure to a second structure. An adhesive layer (14) used to secure a sensor die (11) to a constraint die (12) in a pressure sensor application is reduced in thickness and/or formed so that adhesive material does not completely cover the constraint die (12). The Tco is further adjusted by reducing the amount and/or patterning the adhesive layer (18) used to secure the sensor (10) to its package (16).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.