Hot melt adhesive compositions
US5994437A · kind A · utility
13Cited by
13References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 1995 |
| Grant date | Nov 30, 1999 |
| Priority date | — |
| Expiry date | Jun 12, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/04
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention is a thermofusible adhesive composition comprising: PA1 a at least one essentially amorphous poly(alpha-olefin), PA1 b at least one copolymer of ethylene and an alkyl (meth)acrylate, the cloud point being below 170.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.