Thermal housing for optical circuits
US5994679A · kind A · utility
16Cited by
20References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 1997 |
| Grant date | Nov 30, 1999 |
| Priority date | — |
| Expiry date | Dec 19, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A housing for optical integrated circuits for protecting the circuit from temperature induced stresses has a base and cap and a thermal bed contained therein. The thermal bed has a region for containing the integrated circuit therein, suspended in a thermally conductive grease. At least one heater is affixed to the thermal bed for heating it, and temperature monitoring apparatus is included for supplying signals to a control apparatus for activating the heater when the temperature of the thermal bed falls outside of the operating temperature range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.