Microwave circuit, capped microwave circuit and use thereof in a circuit arrangement
US5994983A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 23, 1997 |
| Grant date | Nov 30, 1999 |
| Priority date | — |
| Expiry date | Dec 23, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0237
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microwave circuit having a two-sided substrate on which a microwave lead-through is arranged in the form of a symmetrical lead-through structure, being provided by opposite metallizationless areas on the upperside and the underside of the substrate and comprising a lead-through conductor, coplanar width adaption segments and first and second line segments connected thereto, the ground of said segments comprising opposite metallization parts being inter-connected through via holes. In a sealed microwave circuit a seal lead-through comprises said lead-through structure and a microstrip line segment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.