Heat exchanger having an extruded, tiered heat sink
US5995367A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1997 |
| Grant date | Nov 30, 1999 |
| Priority date | — |
| Expiry date | Dec 18, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved heat exchanger (10) has an extruded, multi-tiered heat sink (22) having a very high heat transfer coefficient structurally associated with a compact, high air velocity air moving means (14). Heat sink (22) has a first tier (56) formed by first fins (34) in a first base element (24) closely spaced apart from third fins (40) in an extruded bridging element (30). A second tier (60) of heat sink (22) is formed by second fins (52) in a second base element (26) closely spaced from fourth fins (46) opposing the third fins (40) in the bridging element (30). Air moving means (16) of the invention employs a backward curved impeller (14) driven by a compact planar dc motor (80) adapted to yield higher than normal impeller speeds with superior thermal transfer performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.